Siemens and Intel to Collaborate on Advanced Semiconductor Manufacturing
西門子和英特爾將在先進半導體製造領域展開合作

Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed a Memorandum of Understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.

領先的科技公司西門子和全球最大的半導體公司之一英特爾公司簽署了一份諒解備忘錄 (MoU)，合作推動微電子製造的數字化和可持續發展。兩家公司將專注於推進未來的製造工作、發展工廠運營和網絡安全，並支持有韌性的全球行業生態係統。

“Semiconductors are the lifeblood of our modern economies. Few things run without chips. Therefore, we’re proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “Our joint efforts will contribute to achieving global sustainability goals.”

“半ban導dao體ti是shi我wo們men現xian代dai經jing濟ji的de命ming脈mai。沒mei有you芯xin片pian就jiu沒mei有you什shen麼me東dong西xi可ke以yi運yun行xing。因yin此ci
，我wo們men很hen自zi豪hao能neng與yu英ying特te爾er合he作zuo
，快kuai速su推tui進jin半ban導dao體ti生sheng產chan。西xi門men子zi將jiang為wei此ci次ci合he作zuo帶dai來lai其qi物wu聯lian網wang硬ying件jian
、軟件和電氣設備的全部尖端產品組合，”數字產業首席執行官兼西門子公司董事會成員Cedrik Neike表示。“我們的共同努力將有助於實現全球可持續發展目標。”

The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore use of “digital twins” of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.

該諒解備忘錄確定了關鍵合作領域，以探索各種舉措，包括優化能源管理和解決整個價值鏈的碳足跡。例如，合作將探索使用複雜
、資本高度密集的製造設施的“數字孿生”來標準化解決方案，其中獲得的每一個效率百分比都是有意義的。

The collaboration will also explore minimizing energy use through advanced modeling of natural resources and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will explore product and supply chain related modeling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.

此ci次ci合he作zuo還hai將jiang探tan索suo通tong過guo對dui整zheng個ge價jia值zhi鏈lian中zhong的de自zi然ran資zi源yuan和he環huan境jing足zu跡ji進jin行xing高gao級ji建jian模mo，最zui大da限xian度du地di減jian少shao能neng源yuan使shi用yong。為wei了le獲huo得de有you關guan產chan品pin相xiang關guan排pai放fang的de更geng多duo信xin息xi，英ying特te爾er將jiang與yu西xi門men子zi一yi起qi探tan索suo產chan品pin和he供gong應ying鏈lian相xiang關guan的de建jian模mo解jie決jue方fang案an
，以yi推tui動dong基ji於yu數shu據ju的de洞dong察cha，幫bang助zhu行xing業ye加jia快kuai減jian少shao集ji體ti足zu跡ji的de進jin程cheng。

“The world needs a more globally balanced, sustainable and resilient semiconductor supply chain to meet the increasing demand for chips,” said Keyvan Esfarjani, Intel executive vice president and chief global operations Officer. “We are excited to build upon Intel’s advanced manufacturing capabilities by expanding our collaboration with Siemens to explore new areas where we can utilize Siemens’ portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities and factory operations. This MOU will benefit regional and global industry value chains.”

英特爾執行副總裁兼首席全球運營官Keyvan Esfarjani表示:“世界需要一個更加全球平衡、可(ke)持(chi)續(xu)和(he)有(you)韌(ren)性(xing)的(de)半(ban)導(dao)體(ti)供(gong)應(ying)鏈(lian)，以(yi)滿(man)足(zu)不(bu)斷(duan)增(zeng)長(chang)的(de)芯(xin)片(pian)需(xu)求(qiu)。我(wo)們(men)很(hen)高(gao)興(xing)能(neng)夠(gou)通(tong)過(guo)擴(kuo)大(da)與(yu)西(xi)門(men)子(zi)的(de)合(he)作(zuo)，以(yi)英(ying)特(te)爾(er)先(xian)進(jin)的(de)製(zhi)造(zao)能(neng)力(li)為(wei)基(ji)礎(chu)

，探(tan)索(suo)新(xin)的(de)領(ling)域(yu)，在(zai)這(zhe)些(xie)領(ling)域(yu)
，我(wo)們(men)可(ke)以(yi)利(li)用(yong)西(xi)門(men)子(zi)的(de)自(zi)動(dong)化(hua)解(jie)決(jue)方(fang)案(an)組(zu)合(he)來(lai)提(ti)高(gao)半(ban)導(dao)體(ti)基(ji)礎(chu)設(she)施(shi)、設施和工廠運營的效率和可持續性。這份諒解備忘錄將有利於區域和全球行業價值鏈。”

Sustainable practices across the entire semiconductor lifecycle, including design, manufacturing, operation, efficiency and recycling, are critical for meeting growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions to reduce computing-related climate impacts across the technology industry and the rest of the global economy. Automation and digitalization hold the key to addressing the challenges as the industry drives toward net-zero greenhouse gas emissions. By combining their strengths and expertise, Siemens and Intel are poised to lead the way in driving positive change.

整個半導體生命周期（包括設計、製造

、運營、效率和回收）的可持續實踐對於滿足對強大、可(ke)持(chi)續(xu)芯(xin)片(pian)不(bu)斷(duan)增(zeng)長(chang)的(de)需(xu)求(qiu)至(zhi)關(guan)重(zhong)要(yao)。技(ji)術(shu)可(ke)以(yi)加(jia)速(su)解(jie)決(jue)方(fang)案(an)，以(yi)減(jian)少(shao)整(zheng)個(ge)技(ji)術(shu)行(xing)業(ye)和(he)全(quan)球(qiu)經(jing)濟(ji)其(qi)他(ta)領(ling)域(yu)與(yu)計(ji)算(suan)相(xiang)關(guan)的(de)氣(qi)候(hou)影(ying)響(xiang)。隨(sui)著(zhe)行(xing)業(ye)朝(chao)著(zhe)溫(wen)室(shi)氣(qi)體(ti)淨(jing)零(ling)排(pai)放(fang)的(de)方(fang)向(xiang)發(fa)展(zhan)，自(zi)動(dong)化(hua)和(he)數(shu)字(zi)化(hua)是(shi)應(ying)對(dui)挑(tiao)戰(zhan)的(de)關(guan)鍵(jian)。通(tong)過(guo)結(jie)合(he)各(ge)自(zi)的(de)優(you)勢(shi)和(he)專(zhuan)業(ye)知(zhi)識(shi)，西(xi)門(men)子(zi)和(he)英(ying)特(te)爾(er)有(you)望(wang)在(zai)推(tui)動(dong)積(ji)極(ji)變(bian)革(ge)方(fang)麵(mian)發(fa)揮(hui)引(yin)領(ling)作(zuo)用(yong)。